In April 2025, Guangdong Hejin Technology Group Co., Ltd. achieved a remarkable milestone. Its “Multilayer Circuit Board with High – Efficiency Heat Dissipation” has been awarded the “Zhuhai Innovative Product Certificate”, marking another glorious moment in the company’s development.
In the electronics industry’s pursuit of high-performance, the heat-dissipation bottleneck has long restricted the upgrade of electronic devices. Hejin Group, adhering to the concept of innovation – driven development, concentrated its superior R & D resources. After numerous tests and improvements, it created this high – efficiency heat – dissipating multilayer PCB. This product successfully breaks through the heat – dissipation limitations of traditional circuit boards, greatly enhancing the stability and reliability of products under high – load operation.
The acquisition of the Zhuhai Innovative Product Certificate is a high recognition of Hejin Group’s R & D strength and innovation capability. Behind this honor lies years of unremitting efforts in technological innovation and the pursuit of excellent quality.
Hejin Group will take this certificate as a new starting point. Upholding its original aspiration, it will focus on technology R & D, continuously make breakthroughs and innovations, and strive forward towards higher goals, creating more splendid achievements in the PCB field.
